Semiconductor Device and Method of Manufacture

ABSTRACT

A semiconductor device having an improved source/drain region profile and a method for forming the same are disclosed. In an embodiment, a method includes etching one or more semiconductor fins to form one or more recesses; and forming a source/drain region in the one ore more recesses, the forming the source/drain region including epitaxially growing a first semiconductor material in the one or more recesses at a temperature of 600° C. to 800° C., the first semiconductor material including doped silicon germanium; and conformally depositing a second semiconductor material over the first semiconductor material at a temperature of 300° C. to 600° C., the second semiconductor material including doped silicon germanium and having a different composition than the first semiconductor material.

PRIORITY CLAIM AND CROSS-REFERENCE

This application claims the benefit of U.S. Provisional Application No.62/737,698, filed on Sep. 27, 2018, entitled “Semiconductor Device andMethod of Manufacture,” which application is hereby incorporated hereinby reference.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as, for example, personal computers, cell phones, digital cameras,and other electronic equipment. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductor layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. However, asthe minimum features sizes are reduced, additional problems arise thatshould be addressed.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates an example of a FinFET in a three-dimensional view,in accordance with some embodiments.

FIG. 2 illustrates a cross-sectional view of a semiconductor substrate,in accordance with some embodiments.

FIG. 3 illustrates a cross-sectional view of a formation of fins, inaccordance with some embodiments.

FIG. 4 illustrates a cross-sectional view of a formation of aninsulation material, in accordance with some embodiments.

FIG. 5 illustrates a cross-sectional view of a planarization of theinsulation material, in accordance with some embodiments.

FIG. 6 illustrates a cross-sectional view of a formation of isolationregions, in accordance with some embodiments.

FIG. 7 illustrates a cross-sectional view of a formation of a dummydielectric layer, a dummy gate layer, and a mask layer, in accordancewith some embodiments.

FIGS. 8A and 8B illustrate cross-sectional views of a formation of adummy gate, a mask, and gate seal spacers, in accordance with someembodiments.

FIGS. 9A and 9B illustrate cross-sectional views of a formation of gatespacers, in accordance with some embodiments.

FIGS. 10A-10C illustrate cross-sectional views of a formation ofrecesses, in accordance with some embodiments.

FIGS. 11A and 11B illustrate cross-sectional views of a formation of afirst source/drain layer, in accordance with some embodiments.

FIGS. 12A and 12B illustrate cross-sectional views of a formation of asecond source/drain layer, in accordance with some embodiments.

FIGS. 13A and 13B illustrate cross-sectional views of a formation of athird source/drain layer, in accordance with some embodiments.

FIGS. 14A and 14B illustrate cross-sectional views of a formation of afourth source/drain layer, in accordance with some embodiments.

FIGS. 15A and 15B illustrate cross-sectional views of a formation of afirst source/drain layer and a second source/drain layer, in accordancewith some embodiments.

FIGS. 16A and 16B illustrate cross-sectional views of a formation of afirst inter-layer dielectric layer, in accordance with some embodiments.

FIGS. 17A and 17B illustrate cross-sectional views of a planarization ofthe first inter-layer dielectric layer, the mask, the gate seal spacers,and the gate spacers, in accordance with some embodiments.

FIGS. 18A and 18B illustrate cross-sectional views of a formation ofrecesses, in accordance with some embodiments.

FIGS. 19A-19C illustrate cross-sectional views of a formation of gatestacks, in accordance with some embodiments.

FIGS. 20A and 20B illustrate cross-sectional views of a formation of asecond inter-layer dielectric layer, in accordance with someembodiments.

FIGS. 21A-21C illustrate cross-sectional views of a formation of a gatecontact and source/drain contacts, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Various embodiments provide processes for forming source/drain regionshaving increased germanium and dopant concentrations, reduced volume,and an increased waviness (e.g., an increased height difference betweena top surface of the source/drain regions and a valley between mergedsource/drain regions). The source/drain regions may be formed byepitaxially growing a first source/drain layer in a recess formed in asemiconductor fin, epitaxially growing a second source/drain layer overthe first source/drain layer, conformally depositing a thirdsource/drain layer over the second source/drain layer, and conformallydepositing a fourth source/drain layer over the third source/drainlayer. The first source/drain layer and the second source/draintemperature are grown at a temperature of about 600° C. to about 800° C.and the third source/drain layer and the fourth source/drain layer aredeposited at a temperature of about 300° C. to about 600° C.Semiconductor devices manufactured according to embodiments of thepresent application and including the source/drain regions mayexperience reduced channel resistance R_(ch), reduced source/drainresistance R_(sd), improved device performance such as increased oncurrent (I_(on)), reduced gate-to-drain capacitance, reduced RC delay,and boosted device speed.

FIG. 1 illustrates an example of a FinFET in a three-dimensional view,in accordance with some embodiments. The FinFET comprises a fin 52 on asubstrate 50 (e.g., a semiconductor substrate). Shallow trench isolation(STI) regions 56 are disposed in the substrate 50, and the fin 52protrudes above and from between neighboring STI regions 56. Althoughthe STI regions 56 are described/illustrated as being separate from thesubstrate 50, as used herein the term “substrate” may be used to referto just the substrate 50 or the substrate 50 inclusive of the STIregions 56. Additionally, although the fin 52 and the substrate 50 areillustrated as a single, continuous material, the fin 52 and/or thesubstrate 50 may comprise a single material or a plurality of materials.In this context, the fin 52 refers to the portion extending between theneighboring STI regions 56.

A gate dielectric layer 104 is along sidewalls and over a top surface ofthe fin 52, and a gate electrode 106 is over the gate dielectric layer104. Source/drain regions 98 are disposed in opposite sides of the fin52 with respect to the gate dielectric layer 104 and gate electrode 106.FIG. 1 further illustrates reference cross-sections that are used inlater figures. Cross-section A-A is along a longitudinal axis of thegate electrode 106 and in a direction, for example, perpendicular to thedirection of current flow between the source/drain regions 98 of theFinFET. Cross-section B-B is perpendicular to cross-section A-A and isalong a longitudinal axis of the fin 52 and in a direction of, forexample, a current flow between the source/drain regions 98 of theFinFET. Cross-section C-C is parallel to cross-section A-A and extendsthrough a source/drain region of the FinFET. Subsequent figures refer tothese reference cross-sections for clarity.

Some embodiments discussed herein are discussed in the context ofFinFETs formed using a gate-last process. In other embodiments, agate-first process may be used. Also, some embodiments contemplateaspects used in planar devices, such as planar FETs. As an example, theFETs discussed herein may be used in a ring-oscillator device.

FIGS. 2 through 21C are cross-sectional views of intermediate stages inthe manufacturing of FinFETs, in accordance with some embodiments. FIGS.2 through 7 illustrate reference cross-section A-A illustrated in FIG.1, except for multiple fins/FinFETs. FIGS. 8A, 9A, 10A, 16A, 17A, 18A,19A, 20A, and 21A are illustrated along reference cross-section A-Aillustrated in FIG. 1, and FIGS. 8B, 9B, 10B, 11A, 12A, 13A, 14A, 15A,16B, 17B, 18B, 19B, 19C, 20B, and 21B are illustrated along a similarcross-section B-B illustrated in FIG. 1, except for multiplefins/FinFETs. FIGS. 10C, 11B, 12B, 13B, 14B, and 21C are illustratedalong reference cross-section C-C illustrated in FIG. 1 in a PMOS regionand FIG. 15B is illustrated along reference cross-section C-Cillustrated in FIG. 1 in an NMOS region, except for multiplefins/FinFETs.

In FIG. 2, a substrate 50 is provided. The substrate 50 may be asemiconductor substrate, such as a bulk semiconductor, asemiconductor-on-insulator (SOI) substrate, or the like, which may bedoped (e.g., with a p-type or an n-type dopant) or undoped. Thesubstrate 50 may be a wafer, such as a silicon wafer. Generally, an SOIsubstrate is a layer of a semiconductor material formed on an insulatorlayer. The insulator layer may be, for example, a buried oxide (BOX)layer, a silicon oxide layer, or the like. The insulator layer isprovided on a substrate, typically a silicon or glass substrate. Othersubstrates, such as a multi-layered or gradient substrate may also beused. In some embodiments, the semiconductor material of the substrate50 may include silicon; germanium; a compound semiconductor includingsilicon carbide, gallium arsenic, gallium phosphide, indium phosphide,indium arsenide, and/or indium antimonide; an alloy semiconductorincluding SiGe, GaAsP, AnnAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP; orcombinations thereof.

The substrate 50 has a region 50N and a region 50P. The region 50N maybe for forming n-type devices, such as NMOS transistors, e.g., n-typeFinFETs. The region 50P may be for forming p-type devices, such as PMOStransistors, e.g., p-type FinFETs. The region 50N may be physicallyseparated from the region 50P (as illustrated by divider 51), and anynumber of device features (e.g., other active devices, doped regions,isolation structures, etc.) may be disposed between the region 50N andthe region 50P.

In FIG. 3, fins 52 are formed in the substrate 50. The fins 52 aresemiconductor strips. In some embodiments, the fins 52 may be formed inthe substrate 50 by etching trenches in the substrate 50. The etchingmay be any acceptable etch process, such as a reactive ion etch (RIE),neutral beam etch (NBE), the like, or a combination thereof. The etchingmay be anisotropic. Although the fins 52 are illustrated in FIG. 3 ashaving linear edges, the fins 52 may have rounded edges or any othersuitable shape.

The fins 52 may be patterned by any suitable method. For example, thefins 52 may be patterned using one or more photolithography processes,including double-patterning or multi-patterning processes. Generally,double-patterning or multi-patterning processes combine photolithographyand self-aligned processes, allowing patterns to be created that have,for example, pitches smaller than what is otherwise obtainable using asingle, direct photolithography process. For example, in one embodiment,a sacrificial layer is formed over the substrate 50 and patterned usinga photolithography process. Spacers are formed alongside the patternedsacrificial layer using a self-aligned process. The sacrificial layer isthen removed, and the remaining spacers may then be used to pattern thefins 52.

In FIG. 4, an insulation material 54 is formed over the substrate 50 andbetween neighboring fins 52. The insulation material 54 may be an oxide,such as silicon oxide, a nitride, the like, or a combination thereof,and may be formed by a high-density plasma chemical vapor deposition(HDP-CVD), a flowable CVD (FCVD) (e.g., a CVD-based material depositionin a remote plasma system and post curing to convert the depositedmaterial to another material, such as an oxide), the like, or acombination thereof. Other insulation materials formed by any acceptableprocess may be used. In the illustrated embodiment, the insulationmaterial 54 is silicon oxide formed by an FCVD process. An annealprocess may be performed once the insulation material 54 is formed. Inan embodiment, the insulation material 54 is formed such that excessinsulation material 54 covers the fins 52. Although the insulationmaterial 54 is illustrated as a single layer, some embodiments mayutilize multiple layers. For example, in some embodiments a liner (notseparately illustrated) may first be formed along a surface of thesubstrate 50 and the fins 52. Thereafter, a fill material, such as thosediscussed above may be formed over the liner.

In FIG. 5, a removal process is applied to the insulation material 54 toremove excess insulation material 54 over the fins 52. In someembodiments, a planarization process such as a chemical mechanicalpolish (CMP), an etch back process, combinations thereof, or the likemay be utilized. The planarization process exposes the fins 52 such thattop surfaces of the fins 52 and the insulation material 54 are levelafter the planarization process is complete.

In FIG. 6, the insulation material 54 is recessed to form shallow trenchisolation (STI) regions 56. The insulation material 54 is recessed suchthat upper portions of fins 52 in the region 50N and in the region 50Pprotrude from between neighboring STI regions 56. Further, the topsurfaces of the STI regions 56 may have a flat surface as illustrated, aconvex surface, a concave surface (such as dishing), or a combinationthereof. The top surfaces of the STI regions 56 may be formed flat,convex, and/or concave by using an appropriate etch. The STI regions 56may be recessed using an acceptable etching process, such as one that isselective to the material of the insulation material 54 (e.g., etchesthe material of the insulation material 54 at a faster rate than thematerial of the fins 52). For example, a chemical oxide removal with asuitable etch process using, for example, dilute hydrofluoric (dHF) acidmay be used.

The process described with respect to FIGS. 2 through 6 is just oneexample of how the fins 52 may be formed. In some embodiments, the fins52 may be formed by an epitaxial growth process. For example, adielectric layer may be formed over a top surface of the substrate 50,and trenches can be etched through the dielectric layer to expose theunderlying substrate 50. Homoepitaxial structures may be epitaxiallygrown in the trenches, and the dielectric layer may be recessed suchthat the homoepitaxial structures protrude from the dielectric layer toform fins 52. Additionally, in some embodiments, heteroepitaxialstructures may be used for the fins 52. For example, the fins 52 in FIG.5 may be recessed, and a material different from the fins 52 may beepitaxially grown over the recessed fins 52. In such embodiments, thefins 52 comprise the recessed material as well as the epitaxially grownmaterial disposed over the recessed material. In an even furtherembodiment, a dielectric layer may be formed over a top surface of thesubstrate 50, and trenches may be etched through the dielectric layer.Heteroepitaxial structures may then be epitaxially grown in the trenchesusing a material different from the substrate 50, and the dielectriclayer may be recessed such that the heteroepitaxial structures protrudefrom the dielectric layer to form the fins 52. In some embodiments wherehomoepitaxial or heteroepitaxial structures are epitaxially grown, theepitaxially grown materials may be in situ doped during growth, whichmay obviate prior and subsequent implantations, although in situ andimplantation doping may be used together.

Still further, it may be advantageous to epitaxially grow a material inregion 50N (e.g., an NMOS region) different from the material in region50P (e.g., a PMOS region). In various embodiments, upper portions of thefins 52 may be formed from silicon germanium (Si_(x)Ge_(1-x), where xmay be in the range of 0 to 1), silicon carbide, pure or substantiallypure germanium, a III-V compound semiconductor, a II-VI compoundsemiconductor, or the like. For example, the available materials forforming a III-V compound semiconductor include, but are not limited to,InAs, AlAs, GaAs, InP, GaN, InGaAs, InAlAs, GaSb, AlSb, AlP, GaP, andthe like.

Further in FIG. 6, appropriate wells (not separately illustrated) may beformed in the fins 52 and/or the substrate 50. In some embodiments, a Pwell may be formed in the region 50N, and an N well may be formed in theregion 50P. In some embodiments, a P well or an N well are formed inboth the region 50N and the region 50P.

In the embodiments with different well types, the different implantsteps for the region 50N and the region 50P may be achieved using aphotoresist or other masks (not shown). For example, a photoresist maybe formed over the fins 52 and the STI regions 56 in the region 50N. Thephotoresist is patterned to expose the region 50P of the substrate 50,such as a PMOS region. The photoresist may be formed by using a spin-ontechnique and may be patterned using acceptable photolithographytechniques. Once the photoresist is patterned, an n-type impurityimplant is performed in the region 50P, and the photoresist may act as amask to substantially prevent n-type impurities from being implantedinto the region 50N, such as an NMOS region. The n-type impurities maybe phosphorus, arsenic, antimony, or the like implanted in the region toa concentration of equal to or less than 10¹⁸ atoms/cm³, such as fromabout 10¹⁷ atoms/cm³ to about 10¹⁸ atoms/cm³. After the implant, thephotoresist is removed, such as by an acceptable ashing process.

Following the implanting of the region 50P, a photoresist is formed overthe fins 52 and the STI regions 56 in the region 50P. The photoresist ispatterned to expose the region 50N of the substrate 50, such as the NMOSregion. The photoresist may be formed by using a spin-on technique andmay be patterned using acceptable photolithography techniques. Once thephotoresist is patterned, a p-type impurity implant may be performed inthe region 50N, and the photoresist may act as a mask to substantiallyprevent p-type impurities from being implanted into the region 50P, suchas the PMOS region. The p-type impurities may be boron, BF₂, indium, orthe like implanted in the region to a concentration of equal to or lessthan 10¹⁸ atoms/cm³, such as from about 10¹⁷ atoms/cm³ to about 10¹⁸atoms/cm³. After the implant, the photoresist may be removed, such as byan acceptable ashing process.

After the implants of the region 50N and the region 50P, an anneal maybe performed to activate the p-type and/or n-type impurities that wereimplanted. In some embodiments, the grown materials of epitaxial finsmay be in situ doped during growth, which may obviate the implantations,although in situ and implantation doping may be used together.

In FIG. 7, a dummy dielectric layer 60 is formed on the fins 52. Thedummy dielectric layer 60 may be, for example, silicon oxide, siliconnitride, a combination thereof, or the like, and may be deposited orthermally grown according to acceptable techniques. A dummy gate layer62 is formed over the dummy dielectric layer 60, and a mask layer 64 isformed over the dummy gate layer 62. The dummy gate layer 62 may bedeposited over the dummy dielectric layer 60 and then planarized by aprocess such as CMP. The mask layer 64 may be deposited over the dummygate layer 62. The dummy gate layer 62 may be a conductive material andmay be selected from a group including amorphous silicon,polycrystalline-silicon (polysilicon), poly-crystallinesilicon-germanium (poly-SiGe), metallic nitrides, metallic silicides,metallic oxides, metals, and the like. The dummy gate layer 62 may bedeposited by physical vapor deposition (PVD), CVD, sputter deposition,or other techniques known and used in the art for depositing conductivematerials. The dummy gate layer 62 may be made of other materials thathave a high etching selectivity from the etching of isolation regions(e.g., the STI regions 56). The mask layer 64 may include, for example,SiN, SiON, or the like. In this example, a single dummy gate layer 62and a single mask layer 64 are formed across the region 50N and theregion 50P. It is noted that the dummy dielectric layer 60 is showncovering only the fins 52 for illustrative purposes only. In someembodiments, the dummy dielectric layer 60 may be deposited such thatthe dummy dielectric layer 60 covers the STI regions 56, extendingbetween the dummy gate layer 62 and the STI regions 56.

FIGS. 8A through 21C illustrate various additional steps in themanufacturing of embodiment devices. FIGS. 8A through 21C illustratefeatures in either of the region 50N and the region 50P. For example,the structures illustrated in FIGS. 8A through 16B may be applicable toboth the region 50N and the region 50P. Differences (if any) in thestructures of the region 50N and the region 50P are described in thetext accompanying each figure.

In FIGS. 8A and 8B, the mask layer 64 (see FIG. 7) may be patternedusing acceptable photolithography and etching techniques to form masks74. The pattern of the masks 74 then may be transferred to the dummygate layer 62 by an acceptable etching technique to form dummy gates 72.In some embodiments (not separately illustrated), the pattern of themasks 74 may also be transferred to the dummy dielectric layer 60 by anacceptable etching technique. The dummy gates 72 cover respectivechannel regions 58 of the fins 52. The pattern of the masks 74 may beused to physically separate each of the dummy gates 72 from adjacentdummy gates 72. The dummy gates 72 may have a lengthwise directionsubstantially perpendicular to the lengthwise direction of respectivefins 52.

Further in FIGS. 8A and 8B, gate seal spacers 80 may be formed onexposed surfaces of the dummy gates 72, the masks 74, and/or the fins52. A thermal oxidation or a deposition followed by an anisotropic etchmay be used to form the gate seal spacers 80.

After the formation of the gate seal spacers 80, implants for lightlydoped source/drain (LDD) regions (not separately illustrated) may beperformed. In the embodiments with different device types, similar tothe implants discussed above in FIG. 6, a mask, such as a photoresist,may be formed over the region 50N, while exposing the region 50P, andappropriate type (e.g., p-type) impurities may be implanted into theexposed fins 52 in the region 50P. The mask may then be removed.Subsequently, a mask, such as a photoresist, may be formed over theregion 50P while exposing the region 50N, and appropriate typeimpurities (e.g., n-type) may be implanted into the exposed fins 52 inthe region 50N. The mask may then be removed. The n-type impurities maybe the any of the n-type impurities previously discussed, and the p-typeimpurities may be the any of the p-type impurities previously discussed.The lightly doped source/drain regions may have a concentration ofimpurities of about 10¹⁵ atoms/cm³ to about 10¹⁶ atoms/cm³. An annealmay be used to activate the implanted impurities.

In FIGS. 9A and 9B, gate spacers 86 are formed on the gate seal spacers80 along sidewalls of the dummy gates 72 and the masks 74. The gatespacers 86 may be formed by conformally depositing an insulatingmaterial and subsequently anisotropically etching the insulatingmaterial. The insulating material of the gate spacers 86 may be siliconnitride, SiCN, a combination thereof, or the like.

FIGS. 10A-14B illustrate various steps in forming source/drain regions98A in the fins 52 in the region 50P. As illustrated in FIGS. 10A-14B,the source/drain regions 98A in the region 50P may be formed using amulti-step epitaxial deposition process. The source/drain regions 98A inthe region 50P, e.g., the PMOS region, may be formed by masking theregion 50N, e.g., the NMOS region, and etching source/drain regions ofthe fins 52 in the region 50P are etched to form recesses 88 in the fins52, as illustrated in FIGS. 10A-10C.

In FIGS. 11A and 11B, a first source/drain layer 90 is epitaxially grownin the recesses 88. The first source/drain layer 90 may include anyacceptable material, such as appropriate for p-type FinFETs. Forexample, in embodiments in which the fin 52 comprises silicon, the firstsource/drain layer 90 in the region 50P may comprise materials exertinga compressive strain in the channel region 58, such as SiGe, SiGeB, Ge,GeSn, or the like. In some embodiments, the first source/drain layer 90may comprise silicon germanium having an atomic percentage of germaniumof about 20 percent to about 40 percent.

The first source/drain layer 90 may be implanted with dopants using insitu doping during growth, or using a process similar to the processpreviously discussed for forming lightly-doped source/drain regions,followed by an anneal. The first source/drain layer 90 may have animpurity concentration of less than about 5×10²⁰ atoms/cm³. The dopantsmay include p-type impurities such as boron, BF₂, indium, or the like.

The first source/drain layer 90 is grown at a temperature of about 600°C. to about 800° C., such as about 700° C. and a pressure of about 5Torr to about 50 Torr, such as about 25 Torr. The first source/drainlayer 90 is grown for a period of about 10 seconds to about 200 seconds,such as about 100 seconds. The first source/drain layer 90 may beepitaxially grown from a precursor gas such as silane, disilane,dichlorosilane, germane, germanium tetrachloride, combinations thereof,or the like. The first source/drain layer 90 has a thickness of about 1nm to about 10 nm, such as about 5 nm. As illustrated in FIGS. 11A and11B, the first source/drain layer 90 may have facets.

In FIGS. 12A and 12B, a second source/drain layer 92 is epitaxiallygrown in the recesses 88 over the first source/drain layer 90. Thesecond source/drain layer 92 may include any acceptable material, suchas appropriate for p-type FinFETs. For example, the second source/drainlayer 92 may comprise materials exerting a compressive strain in thechannel region 58, such as SiGe, SiGeB, Ge, GeSn, or the like. In someembodiments, the second source/drain layer 92 may comprise silicongermanium having an atomic percentage of germanium of about 40 percentto about 50 percent.

The second source/drain layer 92 may be implanted with dopants using insitu doping during growth, or using a process similar to the processpreviously discussed for forming lightly-doped source/drain regions,followed by an anneal. The second source/drain layer 92 may have animpurity concentration of greater than about 6×10²⁰ atoms/cm³. Thedopants may include p-type impurities such as boron, BF₂, indium, or thelike.

The first source/drain layer 90 is grown at a temperature of about 600°C. to about 800° C., such as about 700° C. and a pressure of about 5Torr to about 50 Torr, such as about 25 Torr. The first source/drainlayer 90 is grown for a period of about 10 seconds to about 200 seconds,such as about 100 seconds. The first source/drain layer 90 may beepitaxially grown from a precursor gas such as silane, disilane,dichlorosilane, germane, germanium tetrachloride, combinations thereof,or the like. The first source/drain layer 90 has a thickness of about 1nm to about 10 nm, such as about 5 nm. As illustrated in FIGS. 11A and11B, the first source/drain layer 90 may have facets.

The second source/drain layer 92 is grown at a temperature of about 600°C. to about 800° C., such as about 700° C. and a pressure of about 5Torr to about 50 Torr, such as about 25 Torr. The second source/drainlayer 92 is grown for a period of about 100 seconds to about 600seconds, such as about 500 seconds. The second source/drain layer 92 maybe epitaxially grown from a precursor gas such as silane, disilane,dichlorosilane, germane, germanium tetrachloride, combinations thereof,or the like. The second source/drain layer 92 has a thickness of lessthan about 25 nm or less than about 40 nm, such as about 20 nm. Asillustrated in FIGS. 12A and 12B, the second source/drain layer 92 mayhave facets. Although the second source/drain layer 92 is illustrated inFIGS. 12A and 12B as being unmerged, in some embodiments, the facets maycause adjacent second source/drain layers 92 to merge.

In FIGS. 13A and 13B, a third source/drain layer 94 is conformallydeposited in the recesses 88 over the second source/drain layer 92. Thethird source/drain layer 94 may be deposited using a conformal processsuch as chemical vapor deposition (CVD), atomic layer deposition (ALD),or the like. The third source/drain layer 94 may include any acceptablematerial, such as appropriate for p-type FinFETs. For example, the thirdsource/drain layer 94 may comprise materials exerting a compressivestrain in the channel region 58, such as SiGe, SiGeB, Ge, GeSn, or thelike. In some embodiments, the third source/drain layer 94 may comprisesilicon germanium having an atomic percentage of germanium of about 60percent to about 80 percent.

In some embodiments, the third source/drain layer 94 may be formed by aselective deposition process. For example, the third source/drain layer94 may be deposited by a selective CVD process or the like. Inrepresentative embodiments an etching gas (e.g., SiH₂Cl₂, HCl, or thelike) may be used to control selective growth between silicon germaniumareas of the second source/drain layer 92 and dielectric surfaces of thedummy dielectric layer 60, the gate spacers 86, the gate seal spacers80, and the masks 74. In other embodiments, deposition and etchingprocesses may be separately performed or otherwise separatelycontrolled. For example, an epitaxial deposition process may beperformed for non-selective growth of the third source/drain layer 94,followed by etching steps to remove deposited material from dielectricsurfaces of the dummy dielectric layer 60, the gate spacers 86, the gateseal spacers 80, and the masks 74 to maintain selectivity.

The third source/drain layer 94 may be implanted with dopants using insitu doping during deposition, or using a process similar to the processpreviously discussed for forming lightly-doped source/drain regions,followed by an anneal. The third source/drain layer 94 may have animpurity concentration of greater than about 8×10²⁰ atoms/cm³. Thedopants may include p-type impurities such as boron, BF₂, indium, or thelike.

The third source/drain layer 94 is deposited at a temperature of about300° C. to about 600° C., such as about 450° C. and a pressure ofgreater than about 20 Torr, such as about 50 Torr. The low-temperaturehigh-pressure process used to form the third source/drain layer 94causes the third source/drain layer 94 to be formed conformally over thesecond source/drain layer 92. As illustrated in FIG. 13B, this avoidsgrowth of the third source/drain layer 94 in the (100) plane betweenadjacent fins 52, such that a valley is formed in a merged portion ofthe third source/drain layer 94 between adjacent fins 52. The thirdsource/drain layer 94 is deposited for a period of about 100 seconds toabout 300 seconds, such as about 200 seconds. The third source/drainlayer 94 may be epitaxially grown from a precursor gas such as silane,disilane, dichlorosilane, germane, germanium tetrachloride, combinationsthereof, or the like. The third source/drain layer 94 has a thickness ofgreater than about 20 nm, such as about 30 nm. As illustrated in FIGS.13A and 13B, the third source/drain layer 94 may have surfaces raisedfrom respective surfaces of the fins 52 and may have facets. Further,the conformal processes used to form the third source/drain layer 94 maycause adjacent third source/drain layers 94 to merge, as illustrated inFIG. 13B.

In FIGS. 14A and 14B, a fourth source/drain layer 96 is conformallydeposited over the third source/drain layer 94 to form source/drainregions 98A comprising the first source/drain layer 90, the secondsource/drain layer 92, the third source/drain layer 94, and the fourthsource/drain layer 96. The fourth source/drain layer 96 may be depositedusing a conformal process such as chemical vapor deposition (CVD),atomic layer deposition (ALD), or the like. The fourth source/drainlayer 96 may include any acceptable material, such as appropriate forp-type FinFETs. For example, the fourth source/drain layer 96 maycomprise materials exerting a compressive strain in the channel region58, such as SiGe, SiGeB, Ge, GeSn, or the like. In some embodiments, thefourth source/drain layer 96 may comprise silicon germanium having anatomic percentage of germanium of less than about 40 percent.

In some embodiments, the fourth source/drain layer 96 may be formed by aselective deposition process. For example, the fourth source/drain layer96 may be deposited by a selective CVD process, a selective ALD process,or the like. In representative embodiments an etching gas (e.g.,SiH₂Cl₂, HCl, or the like) may be used to control selective growthbetween silicon germanium areas of the third source/drain layer 94 anddielectric surfaces of the dummy dielectric layer 60, the gate spacers86, the gate seal spacers 80, and the masks 74. In other embodiments,deposition and etching processes may be separately performed orotherwise separately controlled. For example, an epitaxial depositionprocess may be performed for non-selective growth of the fourthsource/drain layer 96, followed by etching steps to remove depositedmaterial from dielectric surfaces of the dummy dielectric layer 60, thegate spacers 86, the gate seal spacers 80, and the masks 74 to maintainselectivity.

The fourth source/drain layer 96 may be implanted with dopants using insitu doping during deposition, or using a process similar to the processpreviously discussed for forming lightly-doped source/drain regions,followed by an anneal. The fourth source/drain layer 96 may have animpurity concentration of greater than about 1×10²⁰ atoms/cm³. Thedopants may include p-type impurities such as boron, BF₂, indium, or thelike.

The fourth source/drain layer 96 is deposited at a temperature of about300° C. to about 600° C., such as about 450° C. The fourth source/drainlayer 96 is deposited for a period from about 10 seconds to about 200seconds, such as about 100 seconds. The fourth source/drain layer 96 hasa thickness of less than about 10 nm, such as about 5 nm. The fourthsource/drain layer 96 may be epitaxially grown from a precursor gas suchas silane, disilane, dichlorosilane, germane, germanium tetrachloride,combinations thereof, or the like. As illustrated in FIGS. 14A and 14B,the fourth source/drain layer 96 may have surfaces raised fromrespective surfaces of the fins 52 and may have facets.

The fourth source/drain layer 96 may be a sacrificial layer or an etchstop layer. For example, as will be discussed in greater detail belowwith respect to FIG. 19B, the fourth source/drain layer 96 may protectthe third source/drain layer 94 during an etch process used to formopenings in which source/drain contacts 116 are formed.

As illustrated in FIG. 14A, a height H1 between a top surface of thefins 52 and a bottom of the fins 52 is greater than about 40 nm. Aheight H2 between the top surface of the fins 52 and a bottom surface ofthe source/drain regions 98A is greater than about 40 nm. A height H3between a top surface of the source/drain regions 98A and the topsurface of the fins 52 is greater than about 3 nm. As illustrated inFIG. 14B, adjacent source/drain regions 98A may be merged. A height H4between the top surface of the source/drain regions 98A and a valleybetween the source/drain regions 98A is greater than about 5 nm. Aheight H5 between a bottom surface of an inner facet of the source/drainregions 98A and the bottom of the fins 52 is greater than 25 nm. Aheight H6 between a bottom surface of an outer facet of the source/drainregions 98A and the bottom of the fins 52 is greater than 20 nm. Theheight H5 and the height H6 of the source/drain regions 98A may begreater in order to confine lateral growth of the first source/drainlayer 90 and the second source/drain layer 92 and to control thecritical dimensions of the source/drain regions 98A. A distance D1between inner surfaces of adjacent fins 52 is greater than 5 nm. Anangle θ1 between intersecting facets at the valley between thesource/drain regions 98A is less than about 90 degrees. An angle θ2between intersecting facets at the top surface of the source/drainregions 98A is less than about 90 degrees. An angle θ3 betweenintersecting facets at an outermost side surface is greater than about90 degrees.

The source/drain regions 98A formed according to the embodimentsdescribed above may have a wavier profile in the reference cross-sectionC-C (e.g., the height H4 may be increased and angle θ1 and angle θ2 maybe decreased), which increases the contact area between the source/drainregions 98A and subsequently formed source/drain contacts 116 (discussedbelow in reference to FIG. 19B) and reduces source/drain resistanceR_(sd). The source/drain regions 98A may also have reduced volume, whichreduces gate-to-drain capacitance C_(gd). Further, the source/drainregions 98A may have greater concentrations of germanium and dopant ions(e.g., boron), which increases the stress exerted on respective channelregions 58, reduces channel resistance R_(ch), reduces the source/drainresistance R_(sd), improves device performance I_(on), reduces RC delay,and boosts device speed.

In FIGS. 15A and 15B, source/drain regions 98B are formed in the fins 52in the region 50N. The source/drain regions 98B may be formed byconventional methods. The source/drain regions 98B in the region 50N,e.g., the NMOS region, may be formed by masking the region 50P, e.g.,the PMOS region, and etching source/drain regions of the fins 52 in theregion 50P are etched to form recesses (not separately illustrated) inthe fins 52. Then, a first source/drain layer 95 in the region 50N isepitaxially grown in the recesses. A second source/drain layer 97 isconformally formed over the first source/drain layer 95 using a processsuch as CVD, ALD, or the like and act as a sacrificial layer or etchstop layer, similar to the fourth source/drain layer 96, discussedabove. The source/drain regions 98B comprise the first source/drainlayer 95 in combination with the second source/drain layer 97. Thesource/drain regions 98B may include any acceptable material, such asappropriate for n-type FinFETs. For example, if the fin 52 is silicon,the source/drain regions 98B in the region 50N may include materialsexerting a tensile strain in the channel region 58, such as silicon,SiC, SiCP, SiP, or the like. The source/drain regions 98B in the region50N may have surfaces raised from respective surfaces of the fins 52 andmay have facets.

The source/drain regions 98B and/or the fins 52 may be implanted withdopants to form source/drain regions, similar to the process previouslydiscussed for forming lightly-doped source/drain regions, followed by ananneal. The source/drain regions may have an impurity concentration ofabout 10¹⁹ cm⁻³ to about 10²¹ cm⁻³. The n-type impurities for thesource/drain regions 98B may be any of the impurities previouslydiscussed. In some embodiments, the source/drain regions 98B may be insitu doped during growth.

As a result of the epitaxy processes used to form the source/drainregions 98B in the region 50N, upper surfaces of the source/drainregions 98B have facets which expand laterally outward beyond sidewallsof the fins 52. In some embodiments, these facets cause adjacentsource/drain regions 98B of a same FinFET to merge as illustrated byFIG. 15B. In other embodiments (not separately illustrated), adjacentsource/drain regions 98B remain separated after the epitaxy process iscompleted.

Major surfaces of the source/drain regions 98A and the source/drainregions 98B may have crystalline planes in the (100) plane in thecross-section A-A, as illustrated in FIGS. 14A and 15A. Major surfacesof the source/drain regions 98A and the source/drain regions 98B mayhave crystalline planes in the (111) plane in the cross-section B-B, asillustrated in FIGS. 14B and 15B.

In FIGS. 16A and 16B, a first ILD 100 is deposited over the structureillustrated in FIGS. 14A-15B. The first ILD 100 may be formed of adielectric material, and may be deposited by any suitable method, suchas CVD, plasma-enhanced CVD (PECVD), or FCVD. Dielectric materials mayinclude phosphosilicate glass (PSG), borosilicate glass (BSG),boron-doped phosphosilicate glass (BPSG), undoped silicate glass (USG),or the like. Other insulation materials formed by any acceptable processmay be used. In some embodiments, a contact etch stop layer (CESL) 101is disposed between the first ILD 100 and the source/drain regions 98Aand 98B, the masks 74, and the gate spacers 86. The CESL 101 maycomprise a dielectric material, such as, silicon nitride, silicon oxide,silicon oxynitride, or the like, having a different etch rate than thematerial of the overlying first ILD 100.

In FIGS. 17A and 17B, a planarization process, such as a CMP, may beperformed to level the top surface of the first ILD 100 with the topsurfaces of the dummy gates 72 or the masks 74. The planarizationprocess may also remove the masks 74 on the dummy gates 72, and portionsof the gate seal spacers 80 and the gate spacers 86 along sidewalls ofthe masks 74. After the planarization process, top surfaces of the dummygates 72, the gate seal spacers 80, the gate spacers 86, and the firstILD 100 are level. Accordingly, the top surfaces of the dummy gates 72are exposed through the first ILD 100. In some embodiments, the masks 74may remain, in which case the planarization process levels the topsurface of the first ILD 100 with the top surfaces of the top surface ofthe masks 74.

In FIGS. 18A and 18B, the dummy gates 72, and the masks 74 if present,are removed in an etching step(s), so that recesses 102 are formed.Portions of the dummy dielectric layer 60 in the recesses 102 may alsobe removed. In some embodiments, only the dummy gates 72 are removed andthe dummy dielectric layer 60 remains and is exposed by the recesses102. In some embodiments, the dummy dielectric layer 60 is removed fromrecesses 102 in a first region of a die (e.g., a core logic region) andremains in recesses 102 in a second region of the die (e.g., aninput/output region). In some embodiments, the dummy gates 72 areremoved by an anisotropic dry etch process. For example, the etchingprocess may include a dry etch process using reaction gas(es) thatselectively etch the dummy gates 72 without etching the first ILD 100 orthe gate spacers 86. Each recess 102 exposes a channel region 58 of arespective fin 52. Each channel region 58 is disposed betweenneighboring pairs of the source/drain regions 98A and the source/drainregions 98B. During the removal, the dummy dielectric layer 60 may beused as an etch stop layer when the dummy gates 72 are etched. The dummydielectric layer 60 may then be optionally removed after the removal ofthe dummy gates 72.

In FIGS. 19A and 19B, gate dielectric layers 104 and gate electrodes 106are formed for replacement gates. FIG. 19C illustrates a detailed viewof region 107 of FIG. 19B. Gate dielectric layers 104 are depositedconformally in the recesses 102, such as on the top surfaces and thesidewalls of the fins 52 and on sidewalls of the gate seal spacers80/gate spacers 86. The gate dielectric layers 104 may also be formed ontop surface of the first ILD 100. In accordance with some embodiments,the gate dielectric layers 104 comprise silicon oxide, silicon nitride,or multilayers thereof. In some embodiments, the gate dielectric layers104 include a high-k dielectric material, and in these embodiments, thegate dielectric layers 104 may have a k value greater than about 7.0,and may include a metal oxide or a silicate of Hf, Al, Zr, La, Mg, Ba,Ti, Pb, and combinations thereof. The formation methods of the gatedielectric layers 104 may include molecular-beam deposition (MBD), ALD,PECVD, and the like. In embodiments where portions of the dummydielectric layer 60 remains in the recesses 102, the gate dielectriclayers 104 include a material of the dummy dielectric layer 60 (e.g.,SiO₂).

The gate electrodes 106 are deposited over the gate dielectric layers104, respectively, and fill the remaining portions of the recesses 102.The gate electrodes 106 may include a metal-containing material such asTiN, TiO, TaN, TaC, Co, Ru, Al, W, combinations thereof, or multilayersthereof. For example, although a single layer gate electrode 106 isillustrated in FIG. 19B, the gate electrode 106 may comprise any numberof liner layers 106A, any number of work function tuning layers 106B,and a fill material 106C as illustrated by FIG. 19C. After the fillingof the gate electrodes 106, a planarization process, such as a CMP, maybe performed to remove the excess portions of the gate dielectric layers104 and the material of the gate electrodes 106, which excess portionsare over the top surface of the first ILD 100. The remaining portions ofmaterial of the gate electrodes 106 and the gate dielectric layers 104thus form replacement gates of the resulting FinFETs. The gateelectrodes 106 and the gate dielectric layers 104 may be collectivelyreferred to as a “gate stack.” The gate and the gate stacks may extendalong sidewalls of a channel region 58 of the fins 52.

The formation of the gate dielectric layers 104 in the region 50N andthe region 50P may occur simultaneously such that the gate dielectriclayers 104 in each region are formed from the same materials, and theformation of the gate electrodes 106 may occur simultaneously such thatthe gate electrodes 106 in each region are formed from the samematerials. In some embodiments, the gate dielectric layers 104 in eachregion may be formed by distinct processes, such that the gatedielectric layers 104 may be different materials, and/or the gateelectrodes 106 in each region may be formed by distinct processes, suchthat the gate electrodes 106 may be different materials. Various maskingsteps may be used to mask and expose appropriate regions when usingdistinct processes.

In FIGS. 20A and 20B, a second ILD 112 is deposited over the first ILD100. In some embodiment, the second ILD 112 is a flowable film formed bya flowable CVD method. In some embodiments, the second ILD 112 is formedof a dielectric material such as PSG, BSG, BPSG, USG, or the like, andmay be deposited by any suitable method, such as CVD and PECVD. Inaccordance with some embodiments, before the formation of the second ILD112, the gate stack (including a gate dielectric layer 104 and acorresponding overlying gate electrode 106) is recessed, so that arecess is formed directly over the gate stack and between opposingportions of gate spacers 86, as illustrated in FIGS. 20A and 20B. A gatemask 110 comprising one or more layers of dielectric material, such assilicon nitride, silicon oxynitride, or the like, is filled in therecess, followed by a planarization process to remove excess portions ofthe dielectric material extending over the first ILD 100. Thesubsequently formed gate contacts 114 (FIGS. 21A-21C) penetrate throughthe gate mask 110 to contact the top surface of the recessed gateelectrode 106.

In FIGS. 21A-21C, gate contacts 114 and source/drain contacts 116 areformed through the second ILD 112 and the first ILD 100 in accordancewith some embodiments. Openings for the source/drain contacts 116 areformed through the first ILD 100, the second ILD 112, and the fourthsource/drain layer 96 or the second source/drain layer 97 (notseparately illustrated), and openings for the gate contacts 114 areformed through the second ILD 112 and the gate mask 110. The openingsmay be formed using acceptable photolithography and etching techniques.A liner, such as a diffusion barrier layer, an adhesion layer, or thelike, and a conductive material are formed in the openings. The linermay include titanium, titanium nitride, tantalum, tantalum nitride, orthe like. The conductive material may be copper, a copper alloy, silver,gold, tungsten, cobalt, aluminum, nickel, or the like. A planarizationprocess, such as a CMP, may be performed to remove excess material froma surface of the second ILD 112. The remaining liner and conductivematerial form the source/drain contacts 116 and the gate contacts 114 inthe openings. As illustrated in FIGS. 21B and 21C, an anneal process maybe performed to form a silicide 118 at the interface between thesource/drain regions 98A and the source/drain contacts 116 and at theinterface between the source/drain regions 98B and the source/draincontacts 116. The source/drain contacts 116 are physically andelectrically coupled to the source/drain regions 98A and thesource/drain regions 98B, and the gate contacts 114 are physically andelectrically coupled to the gate electrodes 106. The source/draincontacts 116 and gate contacts 114 may be formed in different processes,or may be formed in the same process. Although shown as being formed inthe same cross-sections, it should be appreciated that each of thesource/drain contacts 116 and gate contacts 114 may be formed indifferent cross-sections, which may avoid shorting of the contacts.

As described above, the source/drain regions 98A may have increasedwaviness (e.g., an increased height difference between top surfaces ofthe source/drain regions 98A and a valley between merged source/drainregions 98A), a decreased volume, and increased concentrations ofgermanium and doped ions. Semiconductor devices including thesource/drain regions 98A have reduced channel resistance R_(ch), reducedsource/drain resistance R_(sd), improved device performance I_(on),reduced gate-to-drain capacitance, reduced RC delay, and boosted devicespeed.

In accordance with an embodiment, a method includes etching one or moresemiconductor fins to form one or more recesses; and formingsource/drain regions in the one or more recesses, the forming thesource/drain regions including epitaxially growing a first semiconductormaterial in the one or more recesses at a temperature of 600° C. to 800°C., the first semiconductor material including doped silicon germanium;and conformally depositing a second semiconductor material over thefirst semiconductor material at a temperature of 300° C. to 600° C., thesecond semiconductor material including doped silicon germanium andhaving a different composition than the first semiconductor material. Inan embodiment, the one or more recesses include a first recess and asecond recess, the first semiconductor material in the first recessmerging with the first semiconductor material in the second recessduring the epitaxially growing the first semiconductor material. In anembodiment, the first semiconductor material includes silicon germaniumhaving an atomic percentage of germanium of 40 to 50 percent and a boronconcentration of greater than 6×10²⁰ atoms/cm³. In an embodiment, theone or more recesses includes a first recess and a second recess, thesecond semiconductor material over the first recess merging with thesecond semiconductor material over the second recess during theconformally depositing the second semiconductor material. In anembodiment, the second semiconductor material includes silicon germaniumhaving an atomic percentage of germanium of 60 to 80 percent and a boronconcentration of greater than 8×10²⁰ atoms/cm³. In an embodiment, thefirst semiconductor material is epitaxially grown at a pressure of 5Torr to 50 Torr, and the second semiconductor material is conformallydeposited at a pressure of greater than 20 Torr. In an embodiment, theepitaxially growing the first semiconductor material includesepitaxially growing a first semiconductor layer in the one or morerecesses, the first semiconductor layer having a thickness of 1 nm to 10nm, the first semiconductor layer including a germanium concentration of20 to 40 atomic percent, the first semiconductor layer including a borondopant concentration of less than 5×10²⁰ atoms/cm³; and epitaxiallygrowing a second semiconductor layer over and in contact with the firstsemiconductor layer, the second semiconductor layer having a thicknessof less than 25 nm, the second semiconductor layer including a germaniumconcentration of 40 to 50 atomic percent, the second semiconductor layerincluding a boron dopant concentration of greater than 6×10²⁰ atoms/cm³.In an embodiment, the conformally depositing the second semiconductormaterial includes conformally depositing a third semiconductor layerover and in contact with the second semiconductor layer, the thirdsemiconductor layer having a thickness of greater than 20 nm, the thirdsemiconductor layer including a germanium concentration of 60 to 80atomic percent, the third semiconductor layer including a boron dopantconcentration of greater than 8×10²⁰ atoms/cm³; and conformallydepositing a fourth semiconductor layer over and in contact with thethird semiconductor layer, the fourth semiconductor layer having athickness of less than 10 nm, the fourth semiconductor layer including agermanium concentration of less than 40 atomic percent, the fourthsemiconductor layer including a boron dopant concentration of greaterthan 1×10²⁰ atoms/cm³.

In accordance with another embodiment, a device includes a fin extendingfrom a substrate; a gate stack over the fin; at least one source/drainregion in the fin adjacent the gate stack, the at least one source/drainregion including a first source/drain material having a germaniumconcentration of 30 to 50 atomic percent and having a thickness of lessthan 30 nm; and a second source/drain material over the firstsource/drain material, the second source/drain material having agermanium concentration of 50 to 80 atomic percent and having athickness of greater than 10 nm; and a source/drain contact contactingthe at least one source/drain region. In an embodiment, the firstsource/drain material includes a first source/drain layer and a secondsource/drain layer over the first source/drain layer, the firstsource/drain layer having a germanium concentration of 30 to 40 atomicpercent and having a thickness of 1 to 10 nm, the second source/drainlayer having a germanium concentration of 40 to 50 atomic percent and athickness of less than 25 nm. In an embodiment, the first source/drainlayer has a dopant ion concentration of less than 5×10²⁰ atoms/cm³, thesecond source/drain layer has a dopant ion concentration of greater than6×10²⁰ atoms/cm³, and the second source/drain material has a dopant ionconcentration of greater than 8×10²⁰ atoms/cm³. In an embodiment, thedevice further includes a third source/drain material over the secondsource/drain material, the third source/drain material having agermanium concentration of less than 40 atomic percent and a thicknessof less than 10 nm. In an embodiment, the device further includes asource/drain contact extending through the third source/drain materialto physically contact to second source/drain material. In an embodiment,the at least one source/drain region includes a first source/drainregion and a second source/drain region and the first source/drainmaterial of the first source/drain region is merged with the firstsource/drain material of the second source/drain region. In anembodiment, the at least one source/drain region includes a firstsource/drain region and a second source/drain region and the secondsource/drain material of the first source/drain region is merged withthe second source/drain material of the second source/drain region. Inan embodiment, the second source/drain material includes a valleybetween the first source/drain region and the second source/drain regionand a first height measured vertically between a topmost surface of thefirst source/drain region and the valley is greater than 5 nm.

In accordance with yet another embodiment, a method includes etching afin to form first openings, the fin extending from a substrate; formingsource/drain regions in the first openings, the forming the source/drainregions includes epitaxially growing a first semiconductor material inthe first openings at a pressure of 5 Torr to 50 Torr, the firstsemiconductor material having a dopant ion concentration of less than5×10²⁰ atoms/cm³; epitaxially growing a second semiconductor materialover the first semiconductor material at a pressure of 5 Torr to 50Torr, the second semiconductor material having a dopant ionconcentration of greater than 6×10²⁰ atoms/cm³; and conformallydepositing a third semiconductor material over the second semiconductormaterial at a pressure of less than 20 Torr, the third semiconductormaterial having a dopant ion concentration of greater than 8×10²⁰atoms/cm³; forming an inter-layer dielectric over the source/drainregion; etching the inter-layer dielectric to form a second openingexposing the third semiconductor material; and forming a source/draincontact extending through the second opening to contact the thirdsemiconductor material. In an embodiment, the method further includesconformally depositing a fourth semiconductor material over the thirdsemiconductor material at a pressure of less than 20 Torr, the fourthsemiconductor material having a dopant ion concentration of greater than1×10²⁰ atoms/cm³. In an embodiment, the source/drain regions include afirst source/drain region and a second source/drain region, the firstsource/drain region and the second source/drain region merging after theepitaxially growing the second semiconductor material. In an embodiment,the first source/drain region and the second source/drain region includefacets, an angle between a first facet of the first source/drain regionand a second facet of the second source/drain region intersecting thefirst facet being less than 90 degrees.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: etching one or moresemiconductor fins to form one or more recesses; and formingsource/drain regions in the one or more recesses, wherein the formingthe source/drain regions comprises: epitaxially growing a firstsemiconductor material in the one or more recesses at a temperature of600° C. to 800° C., the first semiconductor material comprising dopedsilicon germanium; and conformally depositing a second semiconductormaterial over the first semiconductor material at a temperature of 300°C. to 600° C., the second semiconductor material comprising dopedsilicon germanium and having a different composition than the firstsemiconductor material.
 2. The method of claim 1, wherein the one ormore recesses comprises a first recess and a second recess, wherein thefirst semiconductor material in the first recess merges with the firstsemiconductor material in the second recess during the epitaxiallygrowing the first semiconductor material.
 3. The method of claim 2,wherein the first semiconductor material comprises silicon germaniumhaving an atomic percentage of germanium of 40 to 50 percent and a boronconcentration of greater than 6×10²⁰ atoms/cm³.
 4. The method of claim1, wherein the one or more recesses comprises a first recess and asecond recess, wherein the second semiconductor material over the firstrecess merges with the second semiconductor material over the secondrecess during the conformally depositing the second semiconductormaterial.
 5. The method of claim 4, wherein the second semiconductormaterial comprises silicon germanium having an atomic percentage ofgermanium of 60 to 80 percent and a boron concentration of greater than8×10²⁰ atoms/cm³.
 6. The method of claim 1, wherein the firstsemiconductor material is epitaxially grown at a pressure of 5 Torr to50 Torr, and wherein the second semiconductor material is conformallydeposited at a pressure of greater than 20 Torr.
 7. The method of claim1, wherein the epitaxially growing the first semiconductor materialcomprises: epitaxially growing a first semiconductor layer in the one ormore recesses, the first semiconductor layer having a thickness of 1 nmto 10 nm, the first semiconductor layer comprising a germaniumconcentration of 20 to 40 atomic percent, the first semiconductor layercomprising a boron dopant concentration of less than 5×10²⁰ atoms/cm³;and epitaxially growing a second semiconductor layer over and in contactwith the first semiconductor layer, the second semiconductor layerhaving a thickness of less than 25 nm, the second semiconductor layercomprising a germanium concentration of 40 to 50 atomic percent, thesecond semiconductor layer comprising a boron dopant concentration ofgreater than 6×10²⁰ atoms/cm³.
 8. The method of claim 7, wherein theconformally depositing the second semiconductor material comprises:conformally depositing a third semiconductor layer over and in contactwith the second semiconductor layer, the third semiconductor layerhaving a thickness of greater than 20 nm, the third semiconductor layercomprising a germanium concentration of 60 to 80 atomic percent, thethird semiconductor layer comprising a boron dopant concentration ofgreater than 8×10²⁰ atoms/cm³; and conformally depositing a fourthsemiconductor layer over and in contact with the third semiconductorlayer, the fourth semiconductor layer having a thickness of less than 10nm, the fourth semiconductor layer comprising a germanium concentrationof less than 40 atomic percent, the fourth semiconductor layercomprising a boron dopant concentration of greater than 1×10²⁰atoms/cm³.
 9. A device comprising: a fin extending from a substrate; agate stack over the fin; at least one source/drain region in the finadjacent the gate stack, the at least one source/drain regioncomprising: a first source/drain material having a germaniumconcentration of 30 to 50 atomic percent and having a thickness of lessthan 30 nm; and a second source/drain material over the firstsource/drain material, the second source/drain material having agermanium concentration of 50 to 80 atomic percent and having athickness of greater than 10 nm; and a source/drain contact contactingthe at least one source/drain region.
 10. The device of claim 9, whereinthe first source/drain material comprises a first source/drain layer anda second source/drain layer over the first source/drain layer, the firstsource/drain layer having a germanium concentration of 30 to 40 atomicpercent and having a thickness of 1 to 10 nm, the second source/drainlayer having a germanium concentration of 40 to 50 atomic percent and athickness of less than 25 nm.
 11. The device of claim 10, wherein thefirst source/drain layer has a dopant ion concentration of less than5×10²⁰ atoms/cm³, wherein the second source/drain layer has a dopant ionconcentration of greater than 6×10²⁰ atoms/cm³, and wherein the secondsource/drain material has a dopant ion concentration of greater than8×10²⁰ atoms/cm³.
 12. The device of claim 9, further comprising a thirdsource/drain material over the second source/drain material, the thirdsource/drain material having a germanium concentration of less than 40atomic percent and a thickness of less than 10 nm.
 13. The device ofclaim 12, further comprising a source/drain contact extending throughthe third source/drain material to physically contact to secondsource/drain material.
 14. The device of claim 9, wherein the at leastone source/drain region comprises a first source/drain region and asecond source/drain region and wherein the first source/drain materialof the first source/drain region is merged with the first source/drainmaterial of the second source/drain region.
 15. The device of claim 9,wherein the at least one source/drain region comprises a firstsource/drain region and a second source/drain region and wherein thesecond source/drain material of the first source/drain region is mergedwith the second source/drain material of the second source/drain region.16. The device of claim 15, wherein the second source/drain materialcomprises a valley between the first source/drain region and the secondsource/drain region and wherein a first height measured verticallybetween a topmost surface of the first source/drain region and thevalley is greater than 5 nm.
 17. A method comprising: etching a fin toform first openings, the fin extending from a substrate; formingsource/drain regions in the first openings, wherein the forming thesource/drain regions comprises: epitaxially growing a firstsemiconductor material in the first openings at a pressure of 5 Torr to50 Torr, the first semiconductor material having a dopant ionconcentration of less than 5×10²⁰ atoms/cm³; epitaxially growing asecond semiconductor material over the first semiconductor material at apressure of 5 Torr to 50 Torr, the second semiconductor material havinga dopant ion concentration of greater than 6×10²⁰ atoms/cm³; andconformally depositing a third semiconductor material over the secondsemiconductor material at a pressure of less than 20 Torr, the thirdsemiconductor material having a dopant ion concentration of greater than8×10²⁰ atoms/cm³; forming an inter-layer dielectric over thesource/drain region; etching the inter-layer dielectric to form a secondopening exposing the third semiconductor material; and forming asource/drain contact extending through the second opening to contact thethird semiconductor material.
 18. The method of claim 17, furthercomprising conformally depositing a fourth semiconductor material overthe third semiconductor material at a pressure of less than 20 Torr, thefourth semiconductor material having a dopant ion concentration ofgreater than 1×10²⁰ atoms/cm³.
 19. The method of claim 17, wherein thesource/drain regions comprise a first source/drain region and a secondsource/drain region, wherein the first source/drain region and thesecond source/drain region merge after the epitaxially growing thesecond semiconductor material.
 20. The method of claim 19, wherein thefirst source/drain region and the second source/drain region comprisefacets, wherein an angle between a first facet of the first source/drainregion and a second facet of the second source/drain region intersectingthe first facet is less than 90 degrees.